IBM BladeCenter HS23


То, о чём так долго твердили большевики говорили на AIXportal свершилось. IBM анонсировала новые серверы-лезвия HS23.

Introduction

The IBM® BladeCenter® HS23 is a next-generation two-socket blade server running the Intel® Xeon® processor E5-2600 product family. With its industry-leading RAS features, energy efficiency, outstanding performance, flexible and scalable I/O, and complete systems management, HS23 offers a robust platform optimized for your mission-critical applications. Standard 30 mm single-wide form-factor protects your investments by providing compatibility with the IBM BladeCenter H, E, S, and HT chassis.

Suggested use: versatile platform to run a broad range of workloads, including infrastructure, virtualization, and enterprise applications.

Did you know?

IBM BladeCenter HS23 is the first BladeCenter server that offers four integrated LAN ports: dual-port Gigabit Ethernet and dual-port 10Gb Ethernet with IBM Virtual Fabric capability. With Emulex 10GbE Virtual Fabric Adapter II for HS23 CFFh expansion card, HS23 scales up to 14 virtual NICs (vNICs) per single-wide blade server for a total of 18 I/O ports with the choice of Ethernet, Fibre Channel, SAS, iSCSI, and FCoE connectivity. 

Key features

The IBM BladeCenter HS23 gives you the networking capacity that you need to manage your data center. The new Virtual Fabric capable integrated 10 GbE offers extreme speed, and the HS23 is designed with highly scalable I/O to give you a total of up to four 10 Gb physical ports that can be divided into up to 14 virtual ports, as well as the ability to run multiple I/O protocols (FCoE/iSCSI). Sixteen DIMM slots supporting up to 256 GB of DDR3 memory allow you to fit more and larger virtual machines per blade. In addition, the HS23 is backward-compatible with all BladeCenter chassis, including the original BladeCenter E. (Some configurations might have restrictions. See Table 5 for compatibility details.)

Availability and serviceability

The BladeCenter HS23 provides many features to simplify serviceability and increase system uptime: 

  • Dual independent power and signal connectors to the BladeCenter chassis midplane provide fault tolerance to increase uptime.
  • The HS23 offers memory mirroring and memory rank sparing for redundancy in the event of a non-correctable memory failure.
  • Tool-less cover removal provides easy access to upgrades and serviceable parts, such as CPU, memory, and adapter cards.
  • The server offers hot-swap drives supporting integrated RAID 1 redundancy for data protection and greater system uptime.
  • The power source independent light path diagnostics panel and individual light path LEDs quickly lead the technician to failed (or failing) components. This simplifies servicing, speeds up problem resolution, and helps improve system availability.
  • The Predictive Failure Analysis (PFA) detects when system components (processors, memory, and hard disk drives) operate outside of standard thresholds and generates pro-active alerts in advance of possible failure, therefore increasing uptime.
  • Solid-state drivers (SSDs) offer significantly better reliability than traditional mechanical HDDs for greater uptime.
  • Built-in Integrated Management Module II (IMM2) continuously monitors system parameters, triggers alerts, and performs recovering actions in case of failures to minimize downtime.
  • Built-in diagnostics using Dynamic Systems Analysis (DSA) Preboot speeds up troubleshooting tasks to reduce service time.
  • Three-year customer replaceable unit and onsite limited warranty, next business day 9x 5. Optional service upgrades are available.


Scalability and performance

The BladeCenter HS23 offers numerous features to boost performance, improve scalability, and reduce costs:

  • The Intel Xeon processor E5-2600 product family improves productivity by offering superior system performance with up to 8-core processors and up to 3.0 GHz core speeds depending on the CPU’s number of cores, up to 20 MB of L3 cache, and QPI interconnect links of up to 8 GT/s.
  • Up to two processors, 16 cores, and 32 threads maximize the concurrent execution of multi-threaded applications.
  • Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows CPU cores to run at maximum speeds during peak workloads by temporarily going beyond processor TDP.
  • Intel Hyper-Threading Technology boosts performance for multi-threaded applications by enabling simultaneous multi-threading within each processor core, up to two threads per core.
  • Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating system vendors to better utilize the hardware for virtualization workloads.
  • Intel Advanced Vector Extensions (AVT) significantly improve floating point performance for compute-intensive technical and scientific applications compared with Intel Xeon 5600 series processors.
  • Up to 16 DDR3 ECC memory RDIMMs provide speeds up to 1600 MHz and a memory capacity of up to 256 GB. (See Table 7 for details.)
  • The theoretical maximum memory bandwidth of the Intel Xeon processor E5 family is 51.6 GBps, which is 60% more than in the previous generation of Intel Xeon processors.
  • The use of solid-state drives (SSDs) instead of or along with traditional spinning drives (HDDs) can significantly improve I/O performance. An SSD can support up to 100 times more I/O operations per second (IOPS) than a typical HDD.
  • The HS23 scales to 18 I/O ports on a single-wide blade with integrated Gigabit Ethernet and 10 Gb Ethernet ports and optional expansion cards, offering the choice of Ethernet, Fibre Channel, SAS, iSCSI, and FCoE connectivity.
  • The HS23 offers PCI Express 3.0 I/O expansion capabilities that improve the theoretical maximum bandwidth by 60% (8 GT/s per link), compared with the previous generation of PCI Express 2.0.
  • With Intel Integrated I/O Technology, the PCI Express 3.0 controller is integrated into the Intel Xeon processor E5 family. This helps to dramatically reduce I/O latency and increase overall system performance.


Manageability and security

Powerful systems management features simplify local and remote management of the HS23:

  • The HS23 includes an Integrated Management Module II (IMM2) to monitor server availability and perform remote management.
  • Integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved setup, configuration, and updates, and simplifies error handling.
  • Integrated Trusted Platform Module (TPM) 1.2 support enables advanced cryptographic functionality, such as digital signatures and remote attestation.
  • Industry-standard AES NI support for faster, stronger encryption.
  • IBM Systems Director is included for proactive systems management. It offers comprehensive systems management tools that help to increase up-time, reduce costs, and improve productivity through advanced server management capabilities.
  • Open Fabric Manager simplifies deployment of infrastructure connections by managing network and storage address assignments.
  • IBM FastSetup simplifies, automates, and speeds up the deployment process from server power-up to production, making BladeCenter easier to manage, deploy, and maintain.
  • Intel Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system.
  • Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks, allowing an application to run in its own isolated space protected from all other software running on a system.


Energy efficiency

The HS23 offers the following energy-efficiency features to save energy, reduce operational costs, increase energy availability, and contribute to the green environment:

  • Component-sharing design of the BladeCenter chassis provides ultimate power and cooling savings.
  • The Intel Xeon processor E5-2600 product family offers significantly better performance over the previous generation while fitting into the same thermal design power (TDP) limits.
  • Intel Intelligent Power Capability powers individual processor elements on and off as needed, to reduce power draw.
  • Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally constrained data centers and telecommunication environments.
  • Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.
  • Solid state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch HDDs.
  • The HS23 uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology. Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow through the system.
  • IBM Systems Director Active Energy Manager™ provides advanced power management features with actual real-time energy monitoring, reporting, and capping features.

Standard specifications

Table 1 lists the standard specifications. 

Table 1. Standard specifications

Components Specifications
Form factor Single-wide (30 mm) blade server.
Chassis support BladeCenter H, BladeCenter HT, BladeCenter S, BladeCenter E. (Some configurations might have restrictions. See Table 5 for compatibility details.)
Processor Up to two Intel Xeon processor E5-2600 product family CPUs with eight-core (up to 2.7 GHz) or six-core (up to 2.9 GHz) or quad-core (up to 2.4 GHz) or dual-core (up to 3.0 GHz). Two QPI links up to 8.0 GT/s each. Up to 1600 MHz memory speed. Up to 20 MB L3 cache.
Chipset Intel C600.
Memory Up to 16 DDR3 DIMM sockets (8 DIMMs per processor) using Very Low Profile (VLP) DIMMs. Support for up to 1600 MHz memory speed depending on the processor. Four memory channels per processor (2 DIMMs per channel).
Memory maximums Up to 256 GB with 16x 16 GB RDIMMs and two processors.
Memory protection ECC, memory mirroring, and memory sparing.
Disk drive bays Two 2.5″ hot-swap SAS/SATA drive bays supporting SAS, SATA, and SSD drives.
Maximum internal storage Up to 1.8 TB with 900 GB 2.5″ SAS HDDs, or up to 2 TB with 1 TB 2.5″ NL SAS HDDs, or up to 2 TB with 1 TB 2.5″ SATA HDDs, or up to 512 GB with 256 GB 2.5″ SATA SSDs. Intermix of SAS and SATA HDDs and SSDs is supported.
RAID support RAID 0, 1, 1E, and 10 with integrated LSI SAS2004 controller.
Network interfaces Two Gigabit Ethernet ports and two 10 Gb Ethernet ports with integrated Emulex BladeEngine 3 (BE3) controller.
PCI Expansion slots One CIOv slot (PCIe 3.0 x8) and one CFFh slot (PCIe 3.0 x16). Two addtional PCIe 2.0 x8 standard form factor slots (slot 1 is full-height full-length, slot 2 is full-height half-length) with the optional PCI Express Gen 2 Expansion Blade II. One HS23 supports up to four PCIe expansion blades (8 slots). Up to four optional GPU expansion blades with either NVIDIA Tesla M2090, M2075, or M2070Q graphics processing units.
Ports One internal USB port (for embedded hypervisor).
Hot-swap components Hard drives.
Systems management UEFI, IBM Integrated Management Module II (IMM2) with Renesas SH7757 controller, Predictive Failure Analysis, light path diagnostics, Automatic Server Restart, IBM Systems Director, and IBM Systems Director Active Energy Manager, IBM ServerGuide.
Security features Power-on password, administrator’s password, Trusted Platform Module (TPM 1.2).
Video Matrox G200eR2 video core with 16 MB video memory integrated into the IMM2. Maximum resolution is 1600×1200 at 75 Hz with 16 M colors (32 bits per pixel).
Operating systems supported Microsoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux 5 and 6 (x64), SUSE Linux Enterprise Server 10 and 11 (for AMD64/EM64T), VMware vSphere 5.
Limited warranty 3-year customer-replaceable unit and onsite limited warranty with 9×5/next business day response time.
Service and support Optional service upgrades are available through IBM ServicePacs®: 4-hour or 2-hour response time, 8-hour fix time, 1-year or 2-year warranty extension, remote technical support for IBM hardware and selected IBM and third-party (Microsoft, Linux, VMware) software.
Dimensions Height: 245 mm (9.7 in), width: 29 mm (1.14 in), depth: 446 mm (17.6 in).
Weight Maximum configuration (single-wide blade): 5.4 kg (12 lb).


The IBM BladeCenter HS23 servers are shipped with the following items:

  • Documentation CD
  • Registration Flyer
  • Statement of Limited Warranty
  • Important Notices
  • Technical Note Flyer

Standard models

Table 2 lists standard models. 

Table 2. Standard models

Model* Intel Xeon processor**
(2 max)
Memory
(std / max)
RAID
controller
Drive bays
(used / max)
Disk
drives
Standard
Ethernet
I/O slots
(used / max)
7875-A1x 1x Xeon E5-2603 4C 1.8GHz
10MB 1066MHz 80 W
1x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb# 0 / 2
7875-A2x 1x Xeon E5-2609 4C 2.4GHz
10MB 1066MHz 80 W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb# 0 / 2
7875-B1x 1x Xeon E5-2620 6C 2.0GHz
15MB 1333MHz 95W
4x 4 GB / 
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-B2x 1x Xeon E5-2640 6C 2.5GHz
15MB 1333MHz 95W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-B3x 1x Xeon E5-2630 6C 2.3GHz
15MB 1333MHz 95W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-C1x 1x Xeon E5-2650 8C 2.0GHz
20MB 1600MHz 95W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-C2x 1x Xeon E5-2660 8C 2.2GHz
20MB 1600MHz 95W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-C3x 1x Xeon E5-2665 8C 2.4GHz
20MB 1600MHz 115W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-C4x 1x Xeon E5-2670 8C 2.6GHz
20MB 1600MHz 115W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-C5x 1x Xeon E5-2680 8C 2.7GHz
20MB 1600MHz 130W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-D1x 1x Xeon E5-2650L 8C 1.8GHz
20MB 1600MHz 70W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-F1x 1x Xeon E5-2648L 8C 1.8GHz
20MB 1600MHz 70W
4x 4GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-G1x†§ 1x Xeon E5-2630 6C 2.3GHz
15MB 1333MHz 95W
4x 4GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
4x 10Gb
1 / 2
7875-G2x†§ 1x Xeon E5-2670 8C 2.6GHz
20MB 1600MHz 115W
4x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
4x 10Gb
1 / 2
7875-91x§‡ 2x Xeon E5-2620 6C 2.0GHz
15MB 1333MHz 95W
16x 8GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-92x§‡ 2x Xeon E5-2650 8C 2.0GHz
20MB 1600MHz 95W
16x 8GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2

* x in the Machine Type Model (MTM) represents a country-specific letter (for example, the EMEA MTM is 7875A1G, and the US MTM is 7875A1U). Ask your local IBM representative for specifics.
** Processor detail: Model, cores, core speed, L3 cache, memory speed, power.
# Supports 10Gb with the addition of the 10 Gb Interposer Card for IBM BladeCenter HS23, 94Y8550.
† These models ship standard with Emulex 10GbE VFA Advanced II for IBM BladeCenter HS23, 90Y9332.
§ These models ship standard with IBM Virtual Fabric Advanced Software Upgrade (LOM), 90Y9310.
‡ These models ship standard with IBM USB Memory Key for VMWare ESXi 5.0, 41Y8300.

Express models

Table 3 lists Express models. 

Table 3. Express models

Model* Intel Xeon processor**
(2 max)
Memory
(std / max)
RAID
controller
Drive bays
(used / max)
Disk
drives
Standard
Ethernet
I/O slots
(used / max)
7875-E1x 2x Xeon E5-2620 6C 2.0GHz
15MB 1333MHz 95W
8x 4 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-E2x 2x Xeon E5-2630 6C 2.3GHz
15MB 1333MHz 95W
8x 8 GB /
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2
7875-E3x 2x Xeon E5-2670 8C 2.6GHz
20MB 1600MHz 115W
8x 8 GB / 
256 GB
Integrated
SAS/SATA
0 / 2 Optional 2x 1Gb
2x 10Gb
0 / 2

* x in the MTM represents a country-specific letter (for example, the EMEA MTM is 86774TG, and the US MTM is 86774TU). Ask your local IBM representative for specifics.
** Processor detail: Model, cores, core speed, L3 cache, memory speed, power.

Chassis support

The HS23 is supported in the various BladeCenter chassis listed in Table 4.

Table 4. Chassis support

Description BC-E 
(8677)
BC-T BC-S
(8886)
BC-H
(8852)
BC-HT AC 
(8750)
BC-HT DC 
(8740)
HS23 with 115W or 130W CPUs No No Full Some limits* Full Full
HS23 with up to 95W CPUs Some limits* No Full Full Full Full

* See Table 5 for details.

The number of HS23 servers supported in each chassis depends on the thermal design power of the processors used in the servers (Table 5). Table 5 uses the following conventions:

  • A green cell means that the chassis can be filled with HS23 blade servers up to the maximum number of blade bays in the chassis (for example, 14 blades in the BladeCenter H).
  • A yellow cell means that the maximum number of HS23 blades that the chassis can hold is fewer than the total available blade bays (for example, 12 in a BladeCenter E). Other bays in the chassis must remain empty. Consult the BladeCenter Interoperability Guide for specific details:http://ibm.com/support/entry/portal/docdisplay?lndocid=MIGR-5073016


Note: The HS23 is not supported in the BladeCenter E with power supplies smaller than 2000 W.

Table 5. Chassis support (detailed)

CPU
TDP*
Maximum number of HS23 servers supported in each chassis
BC-E with AMM
(8677) (14 bays)
BC-S
(8886)
(6 bays)
BC-H (models other than 4Tx)
(14 bays)
BC-H(-4Tx)
(14 bays)
BC-HT AC§
(8750)
(12 bays)
BC-HT DC§ 
(8740)
(12 bays)
2000 W
power
supplies
2320 W
power
supplies
2900W supplies
2980W supplies**
2980W
Standard
blowers
Enhanced
blowers†
Standard
blowers
Enhanced
blowers†
Enhanced
blowers†
Intel Xeon processors
130W
None‡
None‡
6
None‡
14
None‡
14
14
12
12
115W
None‡
None‡
6
None‡
14
None‡
14
14
12
12
95W
None‡
None‡
6
None‡
14
None‡
14
14
12
12
80W
14
14
6
14
14
14
14
14
12
12
70W
None‡
None‡
6
None‡
14
None‡
14
14
12
12
60W
None‡
None‡
6
None‡
14
None‡
14
14
12
12
Intel Xeon Embedded processors#
95W
12
14
6
14
14
14
14
14
12
12
70W
14
14
6
14
14
14
14
14
12
12

* Thermal Design Power.
** IBM BladeCenter H 2980W AC Power Modules, 68Y6601 (standard in 4Tx, optional with all other BC-H models).
† IBM BladeCenter H Enhanced Cooling Modules, 68Y6650 (standard in 4Tx, optional with all other BC-H models).
‡ Not supported.
# Intel Xeon E5-2648L (70 W) and E5-2658 (95 W) are embedded processors used in HS23.
§ Support shown is for non-NEBS environments.

Processor options

The HS23 supports the processor options listed in Table 6. The server supports one or two processors. Table 6 also shows which server models have each processor standard. If no corresponding where used model for a particular processor is listed, then this processor is available only through Configure to Order (CTO).

Table 6. Processor options

Part
number
Intel Xeon processor description Models
where used
81Y9292 Intel Xeon Processor E5-2603 4C 1.8GHz 10MB 1066MHz 80 W A1x
81Y9294 Intel Xeon Processor E5-2609 4C 2.4GHz 10MB 1066MHz 80 W A2x
81Y9295 Intel Xeon Processor E5-2620 6C 2.0GHz 15MB 1333MHz 95W B1x, 91x, E1x
94Y8572 Intel Xeon Processor E5-2630 6C 2.3GHz 15MB 1333MHz 95W B3x, E2x, G1x
81Y9304 Intel Xeon Processor E5-2630L 6C 2.0GHz 15MB 1333MHz 60W
94Y8570 Intel Xeon Processor E5-2637 2C 3.0GHz 5MB 1600MHz 80W
94Y8571 Intel Xeon Processor E5-2640 6C 2.5GHz 15MB 1333MHz 95W B2x
94Y8562* Intel Xeon Processor E5-2648L 8C 1.8GHz 20MB 1600MHz 70W F1x
81Y9298 Intel Xeon Processor E5-2650 8C 2.0GHz 20MB 1600MHz 95W C1x, 92x
81Y9305 Intel Xeon Processor E5-2650L 8C 1.8GHz 20MB 1600MHz 70W D1xy
94Y8565* Intel Xeon Processor E5-2658 8C 2.1GHz 20MB 1600MHz 95W
81Y9299 Intel Xeon Processor E5-2660 8C 2.2GHz 20MB 1600MHz 95W C2x
94Y8671 Intel Xeon Processor E5-2665 8C 2.4GHz 20MB 1600MHz 115W C3x
81Y9302 Intel Xeon Processor E5-2667 6C 2.9GHz 15MB 1600MHz 130W
94Y8589 Intel Xeon Processor E5-2670 8C 2.6GHz 20MB 1600MHz 115W C4x, E3x, G2x
81Y9300 Intel Xeon Processor E5-2680 8C 2.7GHz 20MB 1600MHz 130W C5x

* Note: Intel Xeon Embedded processors.

Memory options

IBM DDR3 memory is compatibility tested and tuned for optimal IBM System x® and BladeCenter performance and throughput. IBM memory specifications are integrated into the light path diagnostics for immediate system performance feedback and optimum system uptime. From a service and support standpoint, IBM memory automatically assumes the IBM system warranty, and IBM provides service and support worldwide.

The BladeCenter HS23 supports Very Low Profile (VLP) DDR3 memory RDIMMs. The server supports up to eight DIMMs when one processor is installed and up to 16 DIMMs when two processors are installed. Each processor has four memory channels, and there are two DIMMs per channel. The following rules apply when selecting the memory configuration:

  • Mixing 1.5 V and 1.35 V DIMMs in the same server is supported. In such a case all DIMMs operate at 1.5 V.
  • The maximum number of ranks supported per channel is eight.
  • The maximum quantity of DIMMs that can be installed in the server depends on the number of CPUs, DIMM rank, and operating voltage, as shown in the «Max. qty supported» row in Table 7.
  • All DIMMs in all CPU memory channels operate at the same speed, which is determined as the lowest value of:
    • Memory speed supported by specific CPU
    • Lowest maximum operating speed for the selected memory configuration that depends on rated speed, as shown under the «Max. operating speed» section in Table 7.


Table 7. Maximum memory speeds

DIMM type

DIMM specification

RDIMM
Rank Single rank Dual rank
Rated speed 1333 MHz 1600 MHz 1333 MHz 1600 MHz
Rated voltage 1.35 V 1.5 V 1.35 V 1.5 V
Operating voltage 1.35 V 1.5 V 1.5 V 1.35 V 1.5 V 1.5 V
Max. qty supported* 16 16 16 16 16 16
Max. DIMM capacity 4 GB 4 GB 4 GB 16 GB 16 GB 8 GB
Max. memory capacity 64 GB 64 GB 64 GB 256 GB 256 GB 128 GB
Max. operating speed (MHz) ______ ______ ______ _______ _______ _______
1 DIMM per channel 1333 1333 1600 1333 1333 1600
2 DIMMs per channel 1333 1333 1600 1333 1333 1600

* The maximum quantity supported is shown for two processors installed. When one processor is installed the maximum quantity supported is a half of that shown.
The following memory protection technologies are supported:

  • ECC
  • Memory mirroring
  • Memory sparing


If memory mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per CPU), and both DIMMs in a pair must be identical in type and size. If memory sparing is used, then DIMMs must be installed in sets of three, and all DIMMs in the same set must be identical in type and size.

Tables 8 lists memory options available for the HS23 server. DIMMs can be installed one at a time, but for performance reasons, install them in sets of four (one for each of the four memory channels). 

Table 8. Memory options for the HS23

Part number Description Max qty
supported
Models
where used
1333 MHz DIMMs
46C0563 4 GB (1x 4 GB, 1Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3 1333 MHz VLP 16
46C0564 4 GB (1x 4 GB, 2Rx8, 1.35 V) PC3L-10600 CL9 ECC DDR3 1333 MHz VLP 16 A1x, A2x, B1x, B2x, B3x, D1x, E1x, F1x, G1x
46C0568 8 GB (1x 8 GB, 2Rx4, 1.35 V) PC3-10600 CL9 ECC DDR3 1333 MHz VLP 16 91x, E2x
46C0599 16 GB (1x 16 GB, 2Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3 1333 MHz VLP 16
1600 MHz DIMMs
90Y3147 4 GB (2Gb, 1Rx4, 1.5 V) PC3-12800 CL11 ECC DDR3 1600 MHz VLP RDIMM 16
90Y3148 4 GB (2Gb, 2Rx8, 1.5 V) PC3-12800 CL11 ECC DDR3 1600 MHz VLP RDIMM 16 C1x, C2x, C3x, C4x, C5x, G2x
90Y3149 8 GB (2Gb, 2Rx4, 1.5 V) PC3-12800 CL11 ECC DDR3 1600 MHz VLP RDIMM 16 92x, E3x

Internal disk storage options

The HS23 server has two hot-swap drive bays accessible from the front of the blade server. These bays are connected to the integrated 4-port LSI SAS2004 6 Gbps SAS/SATA RAID-on-Chip (ROC) controller.

The integrated LSI SAS2004 ROC has the following features:

  • Four-port controller with 6 Gbps throughput per port
  • PCIe x4 Gen 2 host interface
  • Two SAS ports routed internally to the two hot-swap drive bays
  • Two ports can be routed externally to the chassis I/O bays 3 and 4 with SAS Connectivity Card (CIOv)
  • Supports RAID levels 0 (Integrated Striping), 1 (Integrated Mirroring), 10 (Integrated Mirroring and Striping), and 1E (Integrated Mirroring Enhanced)
  • Supports up to 14 drives (up to 12 integrated RAID drives and up to two hot-spare drives) for integrated RAID configurations
  • Supports up to 10 integrated RAID drives per integrated volume
  • Supports up to two integrated volumes
  • Supports volumes greater than 2 TB for RAID 0, 10, and 1E
  • Supports SAS and SATA HDDs and SSDs
  • Supports connectivity to the EXP2500 series and EXP3000 storage expansion enclosures
  • Support connectivity to the tape drives and external storage systems


Table 9 lists the hard drive options that are available for internal storage. 

Table 9. Disk drive options for internal disk storage

Partnumber Description Maximum quantity supported
SAS HDDs
90Y8926 IBM 146GB 15K 6Gbps SAS 2.5″ SFF G2HS HDD 2
90Y8877 IBM 300GB 10K 6Gbps SAS 2.5″ SFF G2HS HDD 2
81Y9670 IBM 300GB 15K 6Gbps SAS 2.5″ Slim-HS HDD 2
90Y8872 IBM 600GB 10K 6Gbps SAS 2.5″ SFF G2HS HDD 2
81Y9650 IBM 900GB 10K 6Gbps SAS 2.5″ Slim-HS HDD 2
NL SAS HDDs
90Y8953 IBM 500GB 7.2K 6Gbps NL SAS 2.5″ SFF G2HS HDD 2
81Y9690 IBM 1TB 7.2K 6Gbps NL SAS 2.5» SFF Slim-HS HDD 2
SATA HDDs
81Y9722 IBM 250GB 7.2K 6Gbps SATA 2.5» SFF Slim-HS HDD 2
81Y9726 IBM 500GB 7.2K 6Gbps SATA 2.5» SFF Slim-HS HDD 2
81Y9730 IBM 1TB 7.2K 6Gbps SATA 2.5» SFF Slim-HS HDD 2
SATA SSDs
43W7718 IBM 200GB SATA 2.5» SFF Slim-HS SSD 2
90Y8648 IBM 128GB SATA 2.5» SFF HS SSD 2
90Y8643 IBM 256GB SATA 2.5» SFF HS SSD 2

I/O expansion options

The HS23 server offers the following PCI Express 3.0 slots:

  • CIOv expansion slot: PCIe 3.0 x8
  • CFFh expansion slot: PCIe 3.0 x16


The CIOv I/O expansion connector provides I/O connections through the midplane of the chassis to modules located in bays 3 and 4 of a supported BladeCenter chassis. The CFFh I/O expansion connector provides I/O connections to high-speed switch modules that are located in bays 7, 8, 9, and 10 of a BladeCenter H or BladeCenter HT chassis, or to switch bay 2 in a BladeCenter S chassis.

The HS23 optionally supports the PCI Express Gen 2 Expansion Blade II. The expansion blade provides the capability to attach selected PCI Express cards to the HS23. This capability is ideal for many applications that require special telecommunications network interfaces or hardware acceleration using a PCI Express card (Table 10).

The expansion blade provides one full-height and full-length PCI Express x16 (x8-wired) Gen 2 slot and one full-height and half-length PCI Express x16 (x8-wired) Gen 2 slot with a maximum power usage of 75 watts for each slot. It integrates PCI Express card support capability into the BladeCenter architecture. Up to four expansion blades can be attached to an HS23. Each expansion blade occupies a bay in the BladeCenter chassis.

Table 10. PCIe expansion blades

Partnumber Description Maximum quantity
supported
68Y7484 IBM BladeCenter PCI Express Gen 2 Expansion Blade II 4


The HS23 server optionally supports GPU Expansion Blade expansion units. This capability is ideal for many applications written to take advantage of acceleration and visualization performance advantages that are offered in general-purpose computing on GPUs. This product ships integrated with one NVIDIA Tesla M2090, one NVIDIA Tesla M2075, or one NVIDIA Tesla M2070Q GPU.

The stacking capability of the IBM BladeCenter GPU Expansion Blade II allows you to connect up to four of them to a single blade server. In addition, you can still use a CFFh I/O expansion card adapter by installing it in the top-most expansion blade.

Table 11 lists the ordering information for the IBM BladeCenter GPU Expansion Blade II variants.

Table 11. GPU expansion blades

Partnumber Description Maximum quantity
supported
00D6881 IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2090 4
68Y7478 IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2075 4
68Y7479 IBM BladeCenter GPU Expansion Blade II with NVIDIA Tesla M2070Q 4

Network adapters

The HS23 offers two integrated Gigabit Ethernet ports and two integrated 10 Gb Ethernet ports with the integrated Emulex BladeEngine 3 (BE3) controller. Two Gigabit Ethernet ports are routed to the chassis I/O bays 1 and 2, and two 10 Gb Ethernet ports are routed to the chassis I/O bays 7 and 9 using either 10Gb LOM Interposer Card or Emulex Virtual Fabric Adapter II for HS23.

The integrated BE3 4-port NIC has the following features:

  • Two Gigabit Ethernet ports and two 10 Gb Ethernet ports (1 Gb and 10 Gb auto-negotiation).
  • Full-duplex (FDX) capability.
  • 10 Gb ports operate in either a virtual NIC (vNIC) or physical NIC (pNIC) mode:
    • vNIC mode: Up to six vNICs (up to three vNICs per one 10 Gb port)
      • Virtual Fabric mode or Switch Independent operational mode.
      • Virtual port bandwidth allocation in 100 Mbps increments.
      • Up to two vNICs can be configured as an iSCSI or FCoE vNICs (one per port) with optional Advanced Upgrade (90Y9310).
    • pNIC mode: dual-port 1/10 Gb Ethernet adapter
  • IPv4/IPv6 offload:
    • TCP, UDP checksum offload
    • Large send offload (LSO)
    • Large receive offload (LRO)
    • Receive side scaling (RSS)
  • IPv4 TCP Chimney Offload.
  • IEEE 802.1Q VLAN tagging.
  • VLAN insertion and extraction.
  • Jumbo frames up to 9000 bytes.
  • Load balancing and failover teaming support, including adapter fault tolerance (AFT), switch fault tolerance (SFT), adaptive load balancing (ALB), and IEEE 802.3ad.
  • Enhanced Ethernet (draft) support:
    • Enhanced Transmission Selection (ETS) (P802.1Qaz)
    • Priority-based Flow Control (PFC) (P802.1Qbb)
    • Data Center Bridging eXchange Protocol (DCBX) (P802.1Qaz)
  • Supports Serial over LAN (SoL) and concurrent KVM (cKVM).
  • Preboot Execution Environment (PXE) support .
  • Wake On LAN support.
  • PCIe x8 Gen 2 host interface.
  • Message Signal Interrupt (MSI-X) support.


Table 12 lists additional supported network adapters and upgrades.

Table 12. Network adapters

Part
number
Description Slots
supported
Maximum
supported
Virtual Fabric Adapters and Upgrades
90Y9310 IBM Virtual Fabric Advanced Software Upgrade (LOM) (License only) 1
81Y3120 Emulex Virtual Fabric Adapter II for HS23 CFFh† 1
90Y9350 Emulex Virtual Fabric Adapter II for HS23 iSCSI and FCoE upgrade (License only) 1
90Y9332 Emulex Virtual Fabric Adapter Advanced II for HS23 CFFh† 1
Converged Network Adapters
81Y1650 Brocade 2 port 10GbE Converged Network Adapter (CFFh) CFFh 1
42C1830 QLogic 2-pt 10Gb Converged Network Adapter (CFFh) CFFh 1
10 Gb Ethernet
94Y8550 10Gb LOM Interposer Card Dedicated connector* 1
46M6168 Broadcom 10Gb Gen2 2-port Ethernet Expansion Card (CFFh) CFFh 1
46M6164 Broadcom 10Gb Gen2 4-port Ethernet Expansion Card (CFFh) CFFh 1
42C1810 Intel 10Gb 2-port Ethernet Expansion Card CFFh CFFh 1
1 Gb Ethernet
44W4479 2/4 Port Ethernet Expansion Card (CFFh) CFFh 1
44W4475 Ethernet Expansion Card (CIOv) CIOv 1
InfiniBand
46M6001 2-port 40Gb InfiniBand Expansion Card (CFFh) CFFh 1

† With Emulex Virtual Fabrics Adapters II for HS23 installed in a blade server, two 10 Gb Ethernet ports on the adapter itself are routed to the chassis I/O bays 8 and 10 (unlike other CFFh cards), and two 10 Gb Ethernet ports integrated on a blade itself are routed to the chassis I/O bays 7 and 9.
* While the 10Gb LOM Interposer card does not consume a CFFh slot, you have to remove it if you plan to install a CFFh expansion card.

Storage host bus adapters

Table 13 lists storage HBAs supported by the HS23 server.

Table 13. Storage adapters

Part
number
Description Slots
supported
Maximum quantity supported
Fibre Channel
46M6140 Emulex 8Gb Fibre Channel Expansion Card (CIOv) CIOv 1
46M6065 QLogic 4Gb Fibre Channel Expansion Card (CIOv) CIOv 1
SAS
43W4068 SAS Connectivity Card (CIOv) CIOv 1

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