IBM Power 770 and 780 Technical Overview and Introduction

Внимание всем тем, кто спешит быть в первых рядах! Вышли новые RedPaper по новым серверам основанным на Power7!

This IBM® Redpaper is a comprehensive guide covering the IBM Power™ 770 and Power 780 servers supporting AIX, IBM i, and Linux operating systems. The goal of this paper is to introduce the major innovative Power 770 and 780 offerings and their prominent functions, including the following.

Unique modular server packaging
The specialized POWER7 Level 3 cache that provides greater bandwidth, capacity, and reliability
The 1 Gb or 10 Gb Integrated Virtual Ethernet adapter that brings native hardware virtualization to this server
PowerVM™ virtualization including PowerVM Live Partition Mobility and PowerVM Active Memory Sharing
Enterprise ready Reliability, Serviceability, and Availability

This Redpaper expands the current set of IBM Power Systems documentation by providing a desktop reference that offers a detailed technical description of the 770 and 780 systems.

This Redpaper does not replace the latest marketing materials and tools. It is intended as an additional source of information that, together with existing materials, may be used to enhance your knowledge of IBM server solutions.

 TOC:

Chapter 1. General description
1.1 Operating environment
1.2 Physical package
1.3 System features
   1.3.1 Power 770 system features
   1.3.2 Power 780 system features
   1.3.3 Minimum features
   1.3.4 Power supply features
   1.3.5 Processor card features
   1.3.6 Summary of processor features
   1.3.7 Memory features
1.4 Disk and media features
1.5 I/O drawers
   1.5.1 PCI-DDR 12X Expansion Drawers (#5796)
   1.5.2 12X I/O Drawer PCIe (#5802 and #5877)
   1.5.3 I/O drawers and usable PCI slot
1.6 Comparison between models
1.7 Build to Order
1.8 IBM Editions
1.9 Model upgrade
   1.9.1 Upgrade considerations
1.10 Hardware Management Console models
1.11 System racks
   1.11.1 IBM 7014 Model T00 rack
   1.11.2 IBM 7014 Model T42 rack
   1.11.3 IBM 7014 Model S25 rack
   1.11.4 Feature number 0555 rack
   1.11.5 Feature number 0551 rack
   1.11.6 Feature number 0553 rack
   1.11.7 The AC power distribution unit and rack content
   1.11.8 Rack-mounting rules
   1.11.9 Useful rack additions
1.11.10 OEM rack
Chapter 2. Architecture and technical overview
2.1 The IBM POWER7 processor
   2.1.1 POWER7 processor overview
   2.1.2 POWER7 processor core
   2.1.3 Simultaneous multithreading
   2.1.4 Memory access
   2.1.5 Flexible POWER7 processor packaging and offerings
   2.1.6 On-chip L3 cache innovation and Intelligent Cache
   2.1.7 POWER7 processor and Intelligent Energy
   2.1.8 Comparison of the POWER7 and POWER6 processors
2.2 POWER7 processor cards
2.3 Memory subsystem
   2.3.1 Fully buffered DIMM
   2.3.2 Memory placement rules
   2.3.3 Memory throughput
2.4 Capacity on Demand
   2.4.1 Capacity Upgrade on Demand
   2.4.2 On/Off Capacity on Demand
   2.4.3 Utility Capacity on Demand
   2.4.4 Trial Capacity On Demand (Trial CoD)
   2.4.5 Software licensing and CoD
2.5 Drawer interconnection cables
2.6 System bus
   2.6.1 I/O buses and GX++ card
   2.6.2 FSP bus
2.7 Internal I/O subsystem
   2.7.1 System ports
2.8 Integrated Virtual Ethernet adapter
   2.8.1 IVE subsystem and feature codes
2.9 PCI adapters
   2.9.1 LAN adapters
2.9.2 Graphics accelerators
   2.9.3 SCSI and SAS adapters
   2.9.4 iSCSI
   2.9.5 Fibre Channel adapter
   2.9.6 Fibre Channel over Ethernet (FCoE)
   2.9.7 Infiniband Host Channel adapter
   2.9.8 Asyncronous adapter
2.10 Internal storage
   2.10.1 Dual split backplane mode
   2.10.2 Triple split backplane
   2.10.3 RAID mode
   2.10.4 DVD
2.11 External I/O subsystems
   2.11.1 PCI-DDR 12X Expansion drawer (#5796)
   2.11.2 12X I/O Drawer PCIe (#5802 & #5877)
   2.11.3 12X I/O Drawer PCIe and PCI-DDR 12X Expansion Drawer 12X cabling
   2.11.4 12X I/O Drawer PCIe and PCI-DDR 12X Expansion Drawer SPCN cabling
2.12 External disk subsystems
   2.12.1 EXP 12S Expansion Drawer
   2.12.2 IBM System Storage
2.13 Hardware Management Console
   2.13.1 HMC Functional overview
   2.13.2 HMC connectitivy to the POWER7 processor based systems
   2.13.3 High availability using the HMC
   2.13.4 HMC Code level
2.14 Operating System Support
2.15 Compiler technology
2.16 Energy management
   2.16.1 IBM EnergyScale technology
   2.16.2 Thermal power management device card (TPMD)
Chapter 3. Virtualization
3.1 POWER Hypervisor
3.2 POWER processor modes
3.3 Active Memory Expansion
3.4 PowerVM
   3.4.1 PowerVM editions
   3.4.2 Logical partitions
   3.4.3 Multiple Shared-Processor Pools
   3.4.4 Virtual I/O Server
   3.4.5 PowerVM Lx86
   3.4.6 PowerVM Live Partition Mobility
   3.4.7 Active Memory Sharing
   3.4.8 NPIV
   3.4.9 Operating System support for PowerVM
   3.4.10 POWER7-specific Linux programming support
3.5 System Planning Tool
Chapter 4. Continuous availability and manageability
4.1 Reliability
   4.1.1 Designed for reliability
   4.1.2 Placement of components
   4.1.3 Redundant components and concurrent repair
4.2 Availability
   4.2.1 Partition availability priority
   4.2.2 General detection and deallocation of failing components
   4.2.3 Memory protection
   4.2.4 Cache protection
   4.2.5 Special uncorrectable error handling
   4.2.6 PCI extended error handling
4.3 Serviceability
   4.3.1 Detecting
   4.3.2 Diagnosing
   4.3.3 Reporting
   4.3.4 Notifying
   4.3.5 Locating and servicing
4.4 Manageability
   4.4.1 Service user interfaces
   4.4.2 IBM Power Systems firmware maintenance
   4.4.3 Electronic Service Agent
4.5 Operating system support for RAS features

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